Photonics Packaging Engineer

Pisa 28-10-2025

Photonics Packaging Engineer

IC Resources Pisa 28-10-2025
Riassunto

Località

Pisa

Divisione Aziendale

Tipo di contratto

Data di pubblicazione

28-10-2025

Descrizione Lavoro

My client is looking for a Packaging Engineer , experienced in photonic and optoelectronic devices to join their R&D team , onsite in Italy!You’ll lead the design, assembly, and optimisation of cutting-edge photonic packaging solutions , working within a collaborative, cross-functional team that supports your growth and development.Your ResponsibilitiesDesign and develop photonic and optoelectronic packaging solutionsCreate mechanical and optical component layoutsSupport micro-optical and fiber optic assembly processEngage in semiconductor assembly processMust HavesMasters degree in Physics, Electronics Engineering or similarSemiconductor, photonics packaging, micro-optical assembly process knowledgeCAD Design tools eg. SolidWorksGood to HaveUnderstanding of PICsCleanroom and advanced packaging technologies experienceThis is a super exciting opportunity to work for innovative generative AI technologies alongside industry-leading scientists. If you're interested, contact Ella Flynn at IC Resources
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