At 2D Photonics and CamGraPhIC we develop ultra-high bandwidth, low-latency optical interconnects for generative AI, cellular, and high-bandwidth data transfer applications.The way we incorporate graphene with silicon photonics preserves its unique electro-optical properties and enables a next generation of optical interconnect devices with reduced electronic complexity, improved energy consumption, and higher channel density.At CamGraPhIC in Pisa, Italy we run the 700 sqm Inphotec Graphene Photonics development facility, where our team of industry-leading scientists, process development and photonics engineers are pioneering the design and fabrication of Photonic Integrated Circuits (PICs) incorporating Graphene.CamGraPhIC Srl is a wholly owned subsidiary of 2D Photonics SpAWe are seeking a Principal Advanced 3D Packaging Engineer to drive the design and development of innovative 3D packaging solutions for ultra-high bandwidth, low latency optical interconnects targeting generative AI, cellular, and high bandwidth data transfer applications. You will have a proven track record in developing innovative packaging solutions for optical or photonics applications.Developing and executing strategies to integrate industry-leading advanced packaging technologies into our optical interconnect solutionsEvaluating and selecting Advanced Packaging technologies across 2.5D, 3D and heterogeneous integration domainsCollaborating with internal silicon, photonics, and simulation teams to co-design packaging solutions and seamlessly integrate devices, substrates and interposersDriving innovation in thermal, power, mechanical and signal integrity simulation and package designEstablishing relationships with foundry partners, OSATs and suppliers to evaluate concepts, develop solutions, and qualify designsBachelor or Master’s in relevant Engineering discipline with 10+ years industry experienceTrack record in 3D Advanced Package development including proven experience in designing for organic, CoWoS or EMIB substrate technologiesDeep understand of materials science and materials selection for substrate and interconnect designTrack record of taking advanced packaging designs from concept through to qualification and productionStrong analytical and problem-solving skills with a data-driven, detail-oriented approachExcellent English verbal and written communication skills
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