OverviewOur innovative new start-up developing ultra-high bandwidth, low latency optical interconnects for generative AI, cellular, and high bandwidth data transfer applications is seeking an Advanced Packaging Engineer to drive the device packaging projects and roadmaps for the company. The role will involve developing 2.5 / 3D advanced packaging solutions and liaising with OSATs for the cycle of concept-explore, design, DFM, engineering runs, development and quality / reliability. Managing the internal packaging team will be a key part of the role as well as driving overall package development within the company. This role can be worked from a remote location.ResponsibilitiesDrive device packaging projects and roadmaps for the company.Develop 2.5 / 3D advanced packaging solutions.Liaise with OSATs throughout concept exploration, design, DFM, engineering runs, development and quality/reliability.Manage the internal packaging team and drive overall package development.QualificationsStrong semiconductor packaging experience and knowledge.2.5 / 3D advanced packaging solutions knowledge.Excellent communication and ability to manage teams.Previous experience liaising with OSATs.Degree qualified.Please contact Rachel Anderson for further details.
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