Our innovative new start-up developing ultra-high bandwidth, low latency optical interconnects for generative AI, cellular, and high bandwidth data transfer applications is now searching for an Advanced Packaging Engineer to drive the device packaging projects and road-maps for the company. The role will involve developing 2.5 / 3D advanced packaging solutions and liaising with OSAT's for the cycle of concept-explore, design, DFM, engineering runs, development and quality / reliability. Managing the internal packaging team will be a key part of the role as well as driving overall package development within the company. This role can worked from a remote location.Required skills for the Advanced Packaging Engineer will include :Strong semiconductor packaging experience and knowledge2.5 / 3D advanced packaging solutions knowledgeExcellent communication and ability to manage teamsPrevious experience with liasing with OSAT'sPlease contact Rachel Anderson for further details.Engineer Packaging • Pisa, Tuscany, Italy
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